| Item | Standard Requirement | Special Requirement |
| Maximum panel size | 1 or 2 layers：400×450mm | |
| 610 x 1200mm Multilayer 450×550mm | ||
| Maximum single board size | 1 or 2 layers：460×580mm | |
| Multilayer ：558×610mm |
| Item | Standard Requirement | Special Requirement |
| Minimum | 1 or 2 layers：0.2mm | |
| Multilayer：4L : 0. 4mm 6L : 0. 8mm | ||
| 8L : 1.0mm 10L : 1.2mm 12L : 1.2mm | ||
| Maximum | 1 or 2 layers：6.0mm | |
| Multilayer：6.0mm | ||
| Copper thickness | 0.5/1/2/3/4/5/6 Oz |
| Item | Standard Requirement | Special Requirement |
| Minimum | Board thickness≤2.0mm | |
| Minimum hole 0.20mm | ||
| Board thickness ＞2.0mm | ||
| Aspect ratio ≤10:1 | ||
| Maximum hole size | 6.0mm | 6.5mm |
| Hole size tolerance for PTH holes | ±0.075mm | ±0.05mm |
| Hole size tolerance for NPTH holes | ±0.05mm | ±0.05mm |
| Item | Standard Requirement | Special Requirement |
| Minimum | 20um |
| Item | Standard Requirement | Special Requirement | |||||
| Minimum | Cu. (Oz) | Mils | Mils | ||||
| 0.5 | 4/4 | 4/4 | |||||
| 1 | 5/5 | 5/5 | |||||
| 2 | 7/7 | 6/6 | |||||
| 3 | 9/9 | 8/8 | |||||
| 4 | 11/11 | 10/10 | |||||
| 5 | 13/13 | 11/11 | |||||
| 6 | 15/15 | 13/13 | |||||
| Outer Layer Line width/Spacing | Cu. (Oz) | Mils | Mils | ||||
| 0.3 | 4/4 | 3/3 | |||||
| 0.5 | 5/5 | 4/4 | |||||
| 1 | 6/6 | 5/5 | |||||
| 2 | 7/7 | 6/6 | |||||
| 3 | 9/9 | 8/8 | |||||
| 4 | 11/11 | 10/10 | |||||
| 5 | 13/13 | 11/11 | |||||
| 6 | 15/15 | 13/13 | |||||
| Inner Layer Spacing Between Holes and Traces | Mils | Mils | |||||
| Cu.(Oz) | 4-8L | 10-12L | 12L | 4-8L | 10-12L | > 12L | |
| 0.5 | 8 | 10 | 14 | 7 | 8 | 12 | |
| 1 | 8 | 10 | 14 | 8 | 10 | 12 | |
| 2 | 10 | 12 | 15 | 8 | 12 | 13 | |
| 3 | 12 | 16 | 16 | 10 | 12 | 14 | |
| 4 | 14 | 18 | 18 | 10 | 14 | 14 | |
| Minimum Isolation Ring | 8 mils | 6 mils | |||||
| Minimum Annual Ring | Via Holes 6 mils | 4 mils | |||||
| component holes: 7 mils | 6 mils | ||||||
| BGA solder points : 10 mils | 6-8 mils | ||||||
| Item | Standard Requirement | Special Requirement |
| Surface Finishing | HAL (lead free), OSP, Immersion Gold | |
| Immersion Silver, Immersion Tin | ||
| Gold flash, Gold fingers | ||
| Gold Flash | Nickel Thickness：100-200u” | |
| Gold Thickness：1-50u” | ||
| ENIG (Immersion Gold) | Nickel Thickness：80-150u” | |
| Gold Thickness：1-3u” | ||
| Gold Fingers | Nickel Thickness：120-150u” | |
| Gold Thickness：1-40u” |
| Item | Standard Requirement | Special Requirement | |
| Copper Thickness (Oz) | Tolerance +/- 20% | Tolerance +/- 10% | |
| Width (mils) | Height (mils) | ||
| 0.3 | 8 | 40 | |
| 0.5 | 8 | 40 | |
| 1 | 10 | 40 | |
| 2 | 12 | 50 | |
| 3 | 14 | 60 | |
| 4 | 16 | 70 | |
| 5 | 18 | 80 | |
| 6 | 20 | 90 | |
| Item | Standard Requirement | Special Requirement |
| Color | Green, White, Black, Yellow, Red, Blue | |
| Soldermask Opening | 2-4 mils | |
| Soldermask Bridge | Minimum: 6 mils (Between IC pins) |
| Item | Standard Requirement | Special Requirement |
| Color | Green, White, Black, Yellow, Red, Blue | |
| Width | 5 mils | |
| Height | 30 mils |
| Item | Standard Requirement | Special Requirement |
| Tolerance | ± 0.15mm | 0.1 mm |
| V-Cut Depth | ± 0.1mm | |
| V-Cut Drift Rate | ± 0.1mm | |
| V-Cut Angle | 20, 30, 45, 60 degrees | |
| The space between the line and the board Edge | Routing : 0.25mm | |
| V-Cut : 0.4mm | ||
| Minimum Board thickness for V-Cut | 0.6mm | 0.4 mm |
| V-Cut size | Max. pnl size : 380 x 380mm | |
| Min. pnl size: 50 x 80mm |
| Item | Standard Requirement | Special Requirement |
| Available in (House) | CEM-3, FR-4, High-TG, FR-4, FR-5 | |
| Polymide, Teflon, AL5052 (Aluminum) | ||
| Rogers 4 Series | ||
| To be consigned | Arlon, Series, Taconic, Nelco | |
| Rogers 5 & 6 Series |
